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WinTech Nano is the leading service laboratory providing one-stop analytical services operating in Singapore and China. Our 24 hours professional services cover Failure Analysis, Material Characterization, IC Circuit Edit, ESD Testing. Our laboratory equip with advanced characterization instruments like TEM, FIB, SIMS, XPS etc. WinTech Nano understands the importance of people as key factor working towards great customer satisfaction. At WinTech Nano, we are innovating every day, pushing the limit of imagination, leading with breakthrough in world-class analytical lab.

Interested applicants, please apply through email hr@wintech-nano.com
Or you may send or fax your full resumes and contact details to:
WinTech Nano-Technology Services Pte. Ltd.
03-28, The Alpha, 10 Science Park Road, Science Park II, Singapore 117684
Fax: (65) 6777 2462

If you wish to visit us, you may look at here

Job opening

senior level Electrical Failure Analysis Engineer

Job description:

This is a position for a senior level Electrical Failure Analysis Engineer. You will be part of our failure analysis team offering consultation and performing failure analysis (FA) on our customers’ products.
This position responsibilities includes but not limited to:

- Perform electrical and physical FA on Integrated circuits (IC), electronic components and assemblies;
- Liaise with customers on their FA needs and design FA flow for their products;
- Identify root cause of failures using modern electrical fault isolation and physical FA techniques;
- Provide technical report of findings and recommendations to customers;
- Collaborate with other analysis function groups including physical FA (FIB/TEM) and materials analysis.

Requirements:
- Demonstrate strong knowledge of device physics of key electronics components, semiconductor circuits and fabrication techniques.
- Excellent analytical skills and detail oriented.
(a) Hands-on experience in IC deprocessing (parallel-lapping / chemical), decapsulation, staining, mechanical polishing, ion milling and various sample preparation techniques;
(b) Familiar with physical examination tools such as SEM/FIB, 2D X-ray, CSAM etc.
(c) Semiconductor product engineering or failure analysis experience is desirable.
(d) Must have electrical/electronic circuit analysis skills.
(e) Experience in fault isolation techniques (TIVA/OBIRCH/PEM/Thermal imaging) is required.
- A passion for problem solving.
- Substantial ability to multi-task with an established track record of delivering results and meeting schedules.
- A team player with strong interpersonal skills both verbal and written, and ability to work effectively within a cross-functional team environment.

Education:
- BS (MS or PhD preferred) in Electrical/Electronic Engineering, Physics, Materials Science or related discipline. At least 5 years of industry experience in electronic/semiconductor industry with expertise in electrical failure analysis, system debug or test.

Job opening

Material Analysis Engineer (Shift)
Responsibilities:

- Perform surface analyses using techniques such as SIMS, XPS and AFM
- Prepare service report for our customers and document.
- Document Failure Analysis operating procedures, training and certification specs.
- Communicate with our customer for selecting proper analytical technique and data interpretation.
- Participate in new failure analysis techniques development and evaluation of new technologies.
Requirements:
- Bachelor in Engineering or Applied Sciences (Physics, Chemistry, Materials).
- Able to work on Night Shift
- Fresh graduates are welcome. Experience in surface analysis and/or UHV equipment is a plus.
- Experience/knowledge in microelectronics, storage media as well as assembly and testing is a plus.
- Possess good communication and written skills in English.
- Team worker and independent player.
- Fluent with both English and Mandarin are desired

Job opening

Failure Analysis Senior Engineer (Shift)
Responsibilities:

- Perform routine Electrical and Physical Failure Analysis work in Semiconductor device
- Perform Design Of Experiment (DOE) for various type of IC failure mode
- Develop new Failure Analysis techniques for new devices
Requirements:
- Degree or Diploma in Engineering with more than 5 years of experience
- Must be able to perform FA study individually
- Experience in FA techniques including: Sample preparation, I-V, X-ray, CSAM, EMMI, TIVA, SEM-EDX, FIB
- Strong hands-on experience in IC cross-section and decapsulation knowledge
- Good English communication and interpersonal skill

Job opening

Test Engineer (ESD)
Responsibilities:

- Formulate ESD and IC test plans based on customer’s requests
- Perform ESD and IC testing
- Generate ESD and IC test reports
- Analyze ESD and IC test failures
- Set up and document ESD and IC testing SOPs
- Develop ESD and IC testing methodologies
Requirements:
- Degree/Master/PhD in Electrical and Electronic Engineering. Fresh graduates are welcome to apply.
- Experience in ESD and IC testing.
- Experience in IC circuit and layout design is a definite plus.
- Good knowledge in semiconductor device physics, wafer processing technology, circuit theory and statistics.
- Able to work in lab environment
- Able to work with flexible working hours
- Good oral and written English communication skills
- Independent, resourceful, methodical and inquisitive
- Good work attitude

Job opening

Transmission Electron Microscopy (TEM) Principle Engineer
Responsibilities:

- Take responsibility of TEM related customer jobs.
- Write technical report on FIB/TEM related jobs
- Develop new TEM applications
- Collaborate with FIB team for TEM quality improvement
- Publish & present in conferences/seminars to build-up company reputation
- Basic TEM instrument trouble shooting and work with instrument service team
Requirements:
- Master or PhD in Engineering with more than 3 years of experience
- Hands-on TEM operation experience including STEM, HRTEM, EDX, EELS
- Hard working with never give up attitude
- Fluent with both English and Mandarin are desired

Job opening

Failure Analysis Technician (Shift)
Responsibilities:

- Perform sample preparation for IC Failure Analysis job request
Requirements:
- Hand-on experience in IC grinding/polishing/IC Decap
- 8-10 years of experience
- Must be able to work in second shift work

Job opening

Focused Ion Beam (FIB) Engineer (Shift)
Responsibilities:

- Perform FIB-SEM analysis on various type of sample request
- Perform TEM sample preparation
- Develop new FIB application
Requirements:
- Degree or Diploma in Engineering with more than 5 years of experience
- Good FIB-SEM, FIB-TEM operation experience
- Must be able to work in second shift or night shift work

Job opening

Account Assistant
Responsibilities:

- Handle full set of account duties
Requirements:
- Diploma in Accountancy or equivalent working experience
- Prefer 2-3 years of account experience
- Able to work under pressure and meet deadlines
- Fluent with English and Mandarin preferred
Interested applicants, please apply through hr2@wintech-nano.com