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Structure Analysis

The semiconductor industry is constantly faced with competitive demands for increased device performance. Today a cutting-edge Integrated Circuit (IC) easily consists of over 100 million transistors with a critical dimension of below 100 nanometers.

Micro-sample preparation techniques for precise locating and cross-sectioning are becoming more crucial than ever. For the time being, FIB is the sole sample preparation solution for IC failure analysis.

At WinTech Nano, we diagnose the IC failures you encounter during your product development and high volume manufacturing stages by conducting microstructure analysis at the specific failure locations. With our strong expertise in Failure Analysis and “can do” attitude, our staff are committed to deliver our highest analysis techniques to your satisfaction.



Material Characterization

Surface analysis is the characterization of the outer few atomic layers of a solid surface. It reveals properties such as morphology, crystal structure, adhesion, thickness, chemical activity, stress, wet-tability, distribution profiles, bio-compatibility, etc. These techniques are commonly utilized to analyzed surface defects at sub-micron and nanometer scales. Combined with FIB’s precise locating and cross-sectioning capability, the application of surface analysis are well-extended to 3D materials analysis, serving a wide range of industries such as Semiconductor, Data Storage, Thin Film, Polymers, and Nano Technology.




Electrical Analysis