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Failure Analysis

The semiconductor industry is constantly faced with competitive demands for increased device performance. Today a cutting-edge Integrated Circuit (IC) easily consists of over 100 million transistors with a critical dimension below 100 nanometers.

Micro-sample preparation techniques for precise locating and cross-sectioning become more crucial than ever. For the time being, FIB is the sole sample preparation solution for IC failure analysis.

At WinTech Nano, we diagnose the IC failures you encounter during your product development and high volume manufacturing stages by conducting microstructure analysis at the specific failure locations. With our strong expertise in Failure Analysis and “can do” attitude, our staff are committed to deliver our highest analysis to your satisfaction.




IC Circuit Edit

IC Circuit edit is an important tool for IC designers to achieve fast and reliable circuit verification result. Circuit edit services is done in the FIB (Focused Ion Beam). FIB with certain GIS (Gas Injection System) sources, ion beam etching speed against certain materials will be accelerated tens of times.

These selective/precision milling/deposition capabilities granted FIB with more powerful applications in IC (Integrated Circuit) circuit modifications (also known as device modification, or micro-surgery). Circuit modification is to rewire or re-pattern certain inter-connections, or cut off certain inter-connections on real chips to realize IC chip function changing. It is very helpful for IC designers to debug their design errors on testing chips before mass-productions.

WinTech Nano offers two types of Circuit Edit services: Circuit Modification & Signal Tapout. We are able to perform circuit edit on decapsulated die or singulated die. WinTech Nano has experience over 1000 circuit edit cases with whole range of



Material Characterization

Surface analysis is the characterization of the outer few atomic layers of a solid surface. It reveals properties such as morphology, crystal structure, adhesion, thickness, chemical activity, stress, wet-tability, distribution profiles, bio-compatibility, etc. These techniques are commonly utilized to analyzed surface defects at sub-micron and nanometer scales. Combined with FIB’s precise locating and cross-sectioning capability, the application of surface analysis are well-extended to 3D materials analysis, serving a wide range of industries such as Semiconductor, Data Storage, Thin Film, Polymers, and Nano Technology.