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Failure Analysis

The semiconductor industry is constantly faced with competitive demands for increased device performance. Today a cutting-edge Integrated Circuit (IC) easily consists of over 100 million transistors with a critical dimension below 100 nanometers.

Micro-sample preparation techniques for precise locating and cross-sectioning become more crucial than ever. For the time being, FIB is the sole sample preparation solution for IC failure analysis.

At WinTech Nano, we diagnose the IC failures you encounter during your product development and high volume manufacturing stages by conducting microstructure analysis at the specific failure locations. With our strong expertise in Failure Analysis and “can do” attitude, our staff are committed to deliver our highest analysis to your satisfaction.