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Dual Beam FIB (Focused Ion Beam)

  • Focused Ion Beam (FIB) is a versatile analysis technique that can be used to expose hidden defects in a variety of substrates.
  • A common application is to prepare samples for TEM analysis using the lift-out technique.
  • Another application of FIB is in circuit editing. Electrical connections can be cut and re-routed within the FIB system.

Strengths Limitations

- Cross-sectioning defects
- Quick TEM sample preparation
- Circuit editing
- Quantitative analysis using EDX attachment

- Whole wafers need to be less than 150mm
- Waterfall effect can complicate analysis

FIB cross-sectioning in process debug

Sn whisker growing mechanism studies

FIB/TEM Lift-Off Technology

More information: http://en.wikipedia.org/wiki/Focused_ion_beam