领先的分析技术

胜科纳米拥有多位半导体领域里知名专家，他们均拥有平均10多年海内外业界经历，具备20年以上的失效分析和可靠性分析测试创业/服务经验。通过将国际一流的分析技术专家团队与半导体一线产品专家相结合，胜科纳米搭建了矩阵式海内外技术团队结构，持续不断地研发出新分析测试技术和表征方法，使公司始终保持在行业内的技术领先优势。

目前胜科纳米国际专家级分析测试团队已获得授权专利20余项（还有30余项专利在申请中），累计在国际顶级会议与杂志上发表论文80余篇，软件著作权登记6件，并参与编写2本书籍，拥有自主研发的全球首创的材料分析、失效分析和可靠性分析技术近百余项。

此外，公司拥有自主研发、独创的实验室生产管理系统。进行对公司各部门重点指标权责化管理，达到公司运营效率的最优化和实现三化（自动化、IT化和信息化），以此提高公司绩效和客户服务质量。

世界领先的制样及分析技术介绍

2022年5月20日胜科纳米喜获中国国家专利局的授权：封装器件水汽入侵路径检测方法及装置 （The method and appliance to study the moisture penetration in molded devices），专利号为： CN114216954 B ZL 2022 1 0164278.7。与此同时，我们的研发团队在国际核心期刊发表了一篇关于该创新技术的论文：Lois Liao Jinzhi, Tian Meng, Du Yong, Ji Qiang, Zhu Lei, Zhang Xi, Hua Younan and Li Xiaomin. Application of deuterium oxide (D₂O) isotope tracing technique for encapsulated QFN failure analysis. Microelectronics Reliability，Volume 135, 114607, August 2022.廖金枝，田梦，杜勇，纪强，朱雷，张兮，华佑南和李晓旻，氧化氘（D2O）同位素示踪技术在封装QFN失效分析中的应用，微电子可靠性，第 135 卷，114607，2022 年 8 月。

用于封装的塑封料（多为环氧树脂）通常是非气密性的。塑封料会吸收大气中的水分，这会对封装的可靠性造成风险。在这项应用研究中，一种塑封料封装器件 QFN 在高加速应力测试 (HAST) 96 小时后发生漏电。尽管怀疑是湿气入侵到QFN导致漏电失效，但没有直接证据证明这个假设。而传统的方法，如X-射线和扫描声学显微镜(C-SAM) 技术由于其检测灵敏度有限，无法检测到器件的任何缺陷。为了解决上述问题，胜科纳米研发团队采用了新技术氧化氘（D₂O）同位素示踪方法，即重水示踪法。该方法首先对QFN 样品进行重水水汽引入， 然后使用飞行时间二次离子质谱（TOF-SIMS）探测样品内重水的信号。结果表明，氘富集在漏电故障区域。该结果直接证明了QFN器件的漏电是由湿气造成的。

1、关于重水示踪法

在半导体器件、显示屏 、芯片使用过程中, 环境中存在的水汽会入侵到样品内部, 而造成很多失效问题, 例如腐蚀、短路和气泡等等。如何进行动态监控水汽入侵的路径和速率，把标准的湿热可靠性实验的结果与水汽侵入结果联系起来，从而得知水汽入侵的途径和入侵的速率和吸水率，以及其对半导体器件可靠性带来的影响，对于了解产品可靠性失效机制、监控产品寿命和约束产品下电红线非常重要。

胜科纳米经过两年的研究开发了重水示踪法来研究水汽入侵状态。重水是由氢的重同位素氘和氧组成的化合物 ，也称为氧化氘，分子式为D₂O。本研究把示踪法应用到半导体器件和显示屏等领域追踪水汽在样品里面的扩散入侵路径。待测样品会放置在重水设备里面引入重水水汽，然后使用飞行时间二次离子质谱(Time-of-Flight Secondary Ion Mass Spectrometry, TOF-SIMS) 分析技术对样品指定的位置进行深度分析，探测重水存在的信号和入侵路径。重水实验结果可以指导触屏研发人员改善产品水汽入侵的薄弱环节，而提供产品的质量和可靠性。

2、纳米荧光探针

（1）技术参数：

可靠性测试。折叠/弯曲

探测尺寸：10纳米/100纳米

多重荧光探针选项

灵敏度。<0.1%

（2）应用：

折叠取裂缝定位

TFE/钝化/密封裂缝

玻璃裂缝

失效分析

纳米荧光定位：OLED弯折区微裂纹、边框微裂纹、TFE微裂纹、玻璃微裂纹

纳米荧光渗透纳米级微裂纹，多波段荧光结合排除干扰定位

胜科纳米（Wintech-Nano）

发表的论文（Publications）

从2014年-2021年

Summary

From 2014-2021, the company published total of 64 technical papers, 2 books and 1 trade mark.

2014 （10 Papers）

1.    Hua Younan, Xing Zhen Xiang and Li Xiaomin, Characterization Studies of Fluorine-induced Corrosion Crystal Defects on Microchip Al Bondpads Using X-ray Photoelectron Spectroscopy. The Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore, ID 88, p94-97 (2014).

2.    Shen Yiqiang, Chen Yixin, Lee Hwangsheng, Chow Shueyin, Xing Zhenxiang, Hua Younan, Li Xiaomin,  XPS and TEM Studies of Oxidation States on Sn Solder Ball. The Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 93, p127-130 (2014).

3.    Chen Yixin, Hao Meng, Shao Jingjing, Lee Esther, Xin Qiuju, Song Lu, Li Kai, Lee Hwang Sheng, Shen Yiqiang,  Xing  Zhen Xiang, Khoo Bing Sheng, Chooi Meailing, Kon Cambridge,  Zhou Yongkai, Feng Yang, Fu Chao, Hua Younan and Li Xiaomin，ATR-FTIR, DUEL BEAM SEM FIB and TOF-SIMS Studies on High Temperature and Moisture Induced “White Haze” Following the Pattern of Electrodes in Touch Panels. The Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 98, p135-138 (2014).

4.    Yongkai Zhou, Younan Hua and Xiaomin Li，Spectrum Sharpening on Rotation Averaged TEM Nano Beam Electron Diffraction Patterns. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p152-155 (2014).

5.   Chen Yixin, Emmanuel Simon, Bing Sheng Khoo, Esther Lee，Meailing Chooi，Hao Meng, Shao Jing Jing, Hua Younan and Li Xiaomin， A comprehensive investigation of the galvanic corrosion induced Ag-Al bonding degradation in microelectronic packaging using Ar ion milling, SEM, Dual Beam FIB-SEM, STEM and TOF-SIMS. The Proceedings of the 40th  International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p166-171 (2014).

6.    Hua Younan, Chen Yixin, Zhou Yongkai, Fu Chao and Li Xiaomin， Failure Mechanism Studies and Root Cause Identification of Non-Stick on Pad on Microchip Al Bondpads. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p219-221 (2014).

7.    Shao Jingjing, Hua Younan, Shen Yiqiang, Lee Hwangshen, Zhou Yongkai, Xing Zhen Xiang, Hao Meng and Li Xiaomin, Al-Cu Alloy Films Characterization & Studies using TOF-SIMS, XPS, AFM, EBSD & TEM. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p505-510 (2014).

8.    Hua Younan, Chen Yixin, Shao Jingjing, Hao Meng, Shen Yue, Xing Zhenxiang，Feng Yang, Fu Chao and Li Xiaomin，Characterization Studies of Non-Stick On Pad (NSOP) Using AES, XPS and TOF-SIMS, 36th International Electronics Manufacturing Technology Conference (IEMT 2014) Renaissance Johor Bahru Hotel, Johor, Malaysia, November 11-13, 2014

9.    Hua Younan, Shao Jingjing, Haomeng, An Wenwen, Xing Zhenxiang, Chen Yixin, Fu Chao and Li Xiaomin, TOF-SIMS Technique and Its Applications in Failure analysis and Material Analysis. The Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p75-83 (2014).

10.   Shen Yiqiang, Hua Younan, Liu Yifei, Chen Yixin, Fu Chao and Li Xiaomin, Studies & Applications of the Standard Samples in Dynamic-SIMS Analysis. The Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p87-92 (2014).

2015 （3 Papers）

11.   Hua Younan, Chen Yixin, Fu Chao and Li Xiaomin，Failure Mechanism Studies and Elimination of Galvanic Corrosion (Al-Cu Cell）on Microchip Aluminum Bondpads in Copper Process. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

12.   Hua Younan, Shen Yue, Chen Yixin, Fu Chao and Li Xiaomin，Studies on a Qualification Method (OSSD) for Microchip Al Bondpads. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

13.   Yongkai Zhou, Shik Lin Lee, Chao Fu, Younan Hua and Xiaomin Li, Fault Isolation and TEM Study in State-Of-Art Thin-Film Transistors. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

2016（8 Papers）

14.   Hua Younan, Hua Younan, Khoo Bingsheng, Henry Leong, Chen Yixin, Chan Eason, Wang Jingyuan and Li Xiaomin. Studies on a Novel Qualification Method of Silicon Nitride Layer The Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016), November 6-10, 2016, Fort Worth Convention Centre, Fort Worth, TX, USA (2016).

15.   Hua Younan, Studies and Application of Auger Monitoring System for Quality Control and Assurance of Al Bondpads. The Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016), November 6-10, 2016, Fort Worth Convention Centre, Fort Worth, TX, USA (2016).

16.   Hua Younan, Shen Yue，Niu Zilu, Chen Yixin and Li Xiaomin, Studies and Applications of SIMS (D-SIMS and TOF-SIMS) in Contamination Analysis. The proceedings of the 6th National SIMS Symposium, 08-12 October, Dalian, China, p21-23 (2016).

17.   Hua Younan, Shen Yue，Niu Zilu, Wu Junxian, Erika Therese S. Abella, Khoo Bingchao, Chen Yixin and Li Xiaomin, Applications of TOF-SIMS and XPS in Failure Analysis and Material Characterization. The proceedings of the 6th National SIMS Symposium, 08-12 October, Dalian, China, p36-38 (2016). 

18.   Hua Younan, Fuchao, Shen Yue, Shan Yuqin, Chen Yixin and Li Xiaomin, Studies and Applications of SEM/EDX, XPS and AES in Failure Analysis and Material Characterization. The proceedings of the CTEX and PCB Conference, 18-20 May, Suzhou, China (2016).

19.   Hua Younan, Shen Yue, Li Kai, Wang Jing Yuan, Chan Yong Shen, Chen Yixin，Fu Chao and Li Xiaomin. Studies on XPS Valence State Analysis of Copper Materials. The proceedings of the 37th International Electronics Manufacturing Technology (IEMT) - 18th Electronics Materials & Packaging (EMAP) Conference, 20-22 September 2016, G-Hotel, Penang, Malaysia，B2.3 (2016).

20.   Hua Younan, Shen Yue, Shan Yuqin,, Chen Yixin，Fu Chao and Li Xiaomin. Application of XPS and TOF-SIMS in Failure Analysis and Characterization of Aluminum Fluoride Defects on Microchip Al Bondpads. The proceedings of the National Surface Analysis Symposium, 10-12 Aug, 2016, Kunming, China (2016).

21.  Yixin Chen, Younan Hua, Bing Sheng Khoo, Henry Leong, Vanie Bagulbagul, Yansong Wang, Yanlin Pan, Eason Chan, Maohua Chen, Jing Yuan Wang, Yue Shen, Zilu Niu, Jun Xian Goh, Erika Therese S. Abella and Xiaomin Li Comprehensive Physical and Chemical Characterization of the Galvanic Corrosion Induced Failures. The Proceedings of the 23rd International Physics and Failure Analysis (IPFA2016), July 2016, Singapore, 191 (10B.4), (2016).

2017 （7 Papers）

22.   Hua Younan, Karen Toh, Shen Yue, Khoo Bingsheng and Li Xiaomin. Studies of TEM/EDX Data Process and Application in Identification of Cu Oxide Compounds, The Proceedings of the 24th International Physics and Failure Analysis (IPFA2017), July 2017, Chengdu, China (2017).

23.   Hua Younan. Studies of Al Bondpad Qualification Methodologies and Application in Backend Process Optimization and Improvement in Wafer Fabrication. The Proceedings of the 24th International Physics and Failure Analysis (IPFA2017), July 2017, Chengdu, China (2017).

24.   Hua Younan, Shen Yue, Shan Yuqin,, Fu Chao and Li Xiaomin. Application of XPS and TOF-SIMS in Failure Analysis and Characterization of Aluminum Fluoride Defects on Microchip Al Bondpads and Studies of Failure Mechanism. The proceedings of the 2017 National Conference on Surface Science and Technology, 11-13 Aug, 2017, Shantou University, Shantou, China (2017).

25.   Hua Younan. Auger/SEM/EDX Analysis and Failure Mechanism Study of Aluminum Bromide Defects in Wafer Fabrication. The proceedings of the 2017 National Conference on Surface Science and Technology, 11-13 Aug, 2017, Shantou University, Shantou, China (2017).

26.   Hua Younan, Shen Yue, Khoo Bingsheng and Li Xiaomin, Studies of Surface Analysis Techniques and Applications in Material Characterization and Failure Analysis, PSECE 2017 - 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) - Paper 23-1600, 21-23 June 2017, SMX Convention Center, Manila, Philippines (2017).

27.   Hua Younan. NSOP Problem and Failure Mechanism Studies. PSECE 2017 - 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) - Paper 23-1600, 21-23 June 2017, SMX Convention Center, Manila, Philippines (2017).

28.   Hua Younan. Studies of Fluorine-induced Corrosion and Defects on Microchip Al Bondpads and Auger Monitoring for Quality Control and Assurance. SSEA17, SEMICON Southeast Asia, Penang, Malaysia (2017).

2018 （11 Papers）

29.   Wang Bisheng, Lois Liao Jinzhi and Li Xiaomin. Characterization of interfacial intermetallic compounds in gold wire bonding with copper pad.  IEEE 20th Electronics Packaging Technology Conference, Singapore, p1-5 (2018).

30.   Hua Younan, Can We Use EDX To Determine Fluorine Contamination Level on A Normal Al Bondpad? The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

31.   Che Yan, Niu Zilu, Hua Younan and Li Xiaomin, A TOF-SIMS investigation of the corrosion-induced failure via grain boundaries in polycrystalline materials. The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

32.   Hua Younan, Wu Mengxue, Niu Zilu, Liu Jiahui, Erika Therese S. Abella,Khin Yin Pang,Shenyue and Li Xiaomin, Studies of Secondary Ion Mass Spectrometry (D-SIMS and TOF-SIMS) and Its Applications in Failure Analysis of Semiconductor, Wafer Fabrication and Packaging, the 7th China SIMS Conference, 08-12, Oct 2018, Suzhou(2018).

33.   Hua Younan, Shenyue, Niu Zilu, Goh Junxian, Erika Therese S. Abella, Khin Yin Pang and Li Xiaomin,X-ray Photoelectron Spectroscopy(XPS) and Time-of-flight Secondary Ion Mass Spectrometry (TOF-SIMS) combined application for quantitative analysis of Phosphorus and Boron, the 7th China SIMS Conference, 08-12, Oct 2018, Suzhou(2018).

34.   Hua Younan, Liang Qichao, Shenyue, Sun Jie and Li Xiaomin, Studies of AES and Application in Monitoring Fluorine Contamination and Quality Control of Al Bondoads of Wafer Fabrication. The Proceedings of the 2018 NMSSA 2018, 12-15, Oct 2018, Suzhou,  China (2018).

35.   Hua Younan, Niu Zilu, Erika Therese S. Abella, Khin Yin Pang,Zhang Nan and Li Xiaomin, Time of Flight Secondary Ion Mass Spectrometry (TOF-SIMS) and Its Application in Biological Sample Analysis and Research. The proceedings of the 2018 NMSSA 2018, 12-15, Oct 2018, Suzhou,  China (2018).

36.   Hua Younan, Shenyue, Goh Junxian, Kee Yehyee and Li Xiaomin, Qualification of Microchip Al Bondpad and Elimination of NSOP, The Proceedings of IEMT Conference 2018, 04-06 Sept 2018,  Malaysia.

37.  Lois Liao Jinzhi; Chen Yan; Wang Bisheng; Li Xiaomin; Fu Chao; Hua Younan, A Review on the Copper Bond Pad Application in Wire Bond Technique,, The 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 IEEE , 08-11 Aug, Shanghai, China (2018).

38.   Binghai Liu, Younan Hua, Zhili Dong, Pik Kee Tan,Yuzhe Zhao, Zhiqiang Mo,Jeffrey Lam, Zhihong Mai, The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM, The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

39.   Binghai Liu, Zhi Li Dong, Younan Hua, Chao Fu, Xiaomin Li, Pik Kee Tan, and Yuzhe Zhao Electron-beam radiation induced degradation of silicon nitride and its impact to semiconductor failure analysis by TEM, AIP Advances vol. 8, 115327 (2018).

2019 （9 Papers）

40.   Lois Liao Jinzhi, Song Jianbo, Zhu Lei, Chen Yan, Cho Nan, Yao Qinghong, Fu Chao, Hua Younan and Li Xiaomin, A study on an abnormal oxidation issue of copper bonding wire. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 115; July 2019, Hangzhou, China (2019).

41.   Wang Bisheng, Lois Liao Jinzhi, Zhang Xi, Li Xiaomin, Hua Younan, Tee Weikok, Yee Boonhwa and Mao Songlin, Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 156; July 2019, Hangzhou, China (2019).

42.   Hua Younan. How To Determine Fluorine Contamination Level On A Normal Al Bondpad? The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 199; July 2019, Hangzhou, China (2019).

43.   Mengxue Wu, Lei Zhu, Jiahui Liu, Younan Hua and Xiaomin Li, Study of cross contamination between InP substrate and Silicon substrate during Phosphors depth profile measurement. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 243; July 2019, Hangzhou, China (2019).

44.   Tan HK, Liu BH, Hua YN and Li XM, Study of Silicon thickness for electron transparency transparency, The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 310; July 2019, Hangzhou, China (2019).

45.   Hua Younan, Studies of Advanced Failure Analysis Techniques and Applications in Advanced Packaging Devices and Product & System Level Test Processing. SSEA2019, SEMICON Southeast Asia, Kuala Lumpur, Malaysia (2019).

46.   Lois Liao Jinzhi, Zhang Xi, Wang Bisheng, Li Xiaomin, Hua Younan, Fu Chao, Tee Weikok, Yee Boonhwa and Mao Songlin, Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations. The Proceedings of the ICICDT conference; 17-19 June 2019, Suzhou, China (2019).

47.   Hua Younan, Studies of characterization and analysis methodologies of Al bondpads and applications in wafer fabrication and assembly processes. The proceedings of the NMSSA 2019, 11-14 August 2019, Chengdou, China, p33 (2019).

48.   Hua Younan, Xu Ke，Kee Yehyee，Zhu Lei and Li Xiaomin，Studies and Applications of AFM in material chacterization and failure analysis. The proceedings of the NMSSA 2019, 11-14 August 2019, Chengdou,  China, p52 (2019).

2020 （5 Papers）

49.   Liao Jinzhi Lois1, Yu Minglang, Tee Weikok, Wang Bisheng, Jia Wenping, Yee Boonhwa, Zheng Haipeng, Zhang Xi, Fu Chao, Hua Younan and Li Xiaomin, COMPREHENSIVE COMPARISON OF THE WIRE BOND RELIABILITY PERFORMANCE OF CU, PDCU AND AG WIRES, CSTIC2020 Shanghai, China 18-20 March (2020).

50.   Din-Ghee Neoh, Tee Weikok, Liao Jinzhi Lois, Jia Wenping, Yee Boonhwa, Boon-Seong LEE, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin, ENHANCING HIGH TEMPERATURE ADHESION PERFORMANCE VIA A RENOVATED LEADFRAME SURFACE TREATMENT, CSTIC2020, Shanghai, China 18-20 March (2020).

51.   Liao Jinzhi Lois, Tee Weikok, Yu Minglang, Wang Bisheng, Zhang Xi, Yee Boonhwa, Hua Younan and Li Xiaomin, bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al, EPTC (2020), Singapore (2020).

52.   Lei Zhu, Caryn Sek, Jun Xian Goh, Yeh Yee Kee, Jing Fang Pan, Yanfei Zhao, Younan Hua, Xiaomin Li，Defect and Contamination Analysis Necessity with Multiple Surface Analytical Techniques, The Proceedings of the 27th International Physics and Failure Analysis (IEEE IPFA2020), Singapore, No. 42（2020）.

53.   Z. Luo, Ling Lu, H. Xie, Y. Xu, X. Chen, A. Talapatra, A. O. Adeyeye, Younan Hua, Xiaomin Li and Y. Wu, Platinum composition dependence of spin-orbit torque in (Fe0.8Mn0.2)1-xPtx single-layer ferromagnet. Appl. Phys. Lett. 117, 172402 (2020).

2021 （12 Papers）

54.   Hua Younan, Liu Binghai, Zhu Lei, Lois Liao and Li Xiaomin,Failure Analysis & Mechanism Studies of the Worm-like Defects in Vias of Wafer Fabrication, EPTC 2021, No-103, Singapore (2021).

55.   Hua Younan, Kee Yehyee, Zhu Lei , Liao Lois, Liu Binghai and Li Xiaomin, Failure Analysis and Elimination of the Bromine-induced Defects in Wafer Fabrication, EPTC 2021, No-104, Singapore (2021).

56.   Lois Jinzhi Liao, Liu Binhai, Xi Zhang, Younan Hua, Xiaomin Li,Atmospheric corrosion of Ag/Cu plated FeNi based leadframe used in MOSFET package, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

57.   Lei Zhu, Derrick Tan, Caryn Sek, Binghai Liu, Younan Hua and Li Xiaomin,Sample Preparation For VCSEL Device Contamination Analysis, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

58.   Sek  Kei  Lin, Lee Pei Lin, Pang Khin Yin, Hua Younan,  Zhu Lei  and  Li  Xiaomin,  Principal

Component Analysis (PCA) of Surface Contamination by TOF-SIMS, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

59.   Yeh Yee Kee, Kei Lin Sek, Lei Zhu, Younan Hua, Xiaomin Li,A Novel CMOS Image Sensor Package Cover Glass White Stain Material Identification Metrology by TOF-SIMS, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

60.   Hua Younan, Zhu Lei， Zhao Yinfei , and Li Xiaomin, Studies on pre-processing methods of semiconductor samples and application in analysis of   phosphorus contamination in wafer fabrication using  secondary ion mass spectrometry. The 8th Chinese National conference on SIMS (SIMS-China VIII), Zhuhai, China (2021)

61.   Hua Younan, Application of Time-of-Flight Secondary Ion Mass Spectrometry in Failure Analysis of Ammonia Ions Contamination on Aluminum Pads of Semiconductor Wafers. The 8th Chinese National conference on SIMS (SIMS-China VIII), Zhuhai, China (2021)

62.   Zhu Lei , Hua Younan, Derrick Tan , Liu Binghai, Zhao Yinfei and Li Xiaomin. VCSEL device contamination secondary ion mass spectrometry analysis and sample preparation method. The 8th Chinese National conference on SIMS (SIMS-China VIII), Zhuhai, China (2021)

63.   Ling Lu, H. Xie, Z. Luo, N. Muthu, X. Chen, Xiaomin Li, Younan Hua and Y. Wu, Frequency selectivity of spin Hall magnetoresistance sensor and its applications in eddy current testing. Appl. Phys. Lett. 118, 012403 (2021).

64.   Ling Lu, Xiaomin Li, Younan Hua and Y. Wu, Magnetic stray field mapping of stainless steel sheets using spin Hall magnetoresistance sensor. AIP Advances 11, 125225 (2021).

65.   Binghai Liu, Andrew Tan, Younan Hua, Mingshen Qiao, Xiaomin Li, Characterization and Failure Analysis of OLED devices by FIB/TEM Techniques. International Conference on Display Technology ( ICDT2021 ) , Fuzhou, China, 25 April, (2021)

2021 （15 Papers）

66.   Younan Hua and Li Xiaomin，Lois Liao, Yuanyuan Liu , Zhang Linhua. Studies and Applications of a New Delineation Method of Silicon Defects in Wafer Fabrication. The Proceedings of the 48th International Symposium for Testing and Failure Analysis (ISTFA 2022), November 1-5, 2022, Portland, Ore. USA (2022).

67.   Lois Liao, Xi Zhang, Younan Hua, Li Xiaomin. Chlorine and sulfur effects on gold wire bond reliability. The Proceedings of the 48th International Symposium for Testing and Failure Analysis (ISTFA 2022), November 1-5, 2022, Portland, Ore. USA (2022).

68.   Younan Hua, Jinzhi Lois Liao, Binhai Liu, Lei Zhu and Xiaomin Li. Studies of Passivation (Si3N4/SiO2) Qualification Method in Wafer Fabrication. The Proceedings of the 29th International Physics and Failure Analysis (IPFA2022), 18 July, Singapore (2022).

69.   Jinzhi Lois Liao, Bisheng Wang, Xi Zhang, Younan Hua, Xiaomin Li. Chlorine effect on copper bonding wire reliability. The Proceedings of the 29th International Physics and Failure Analysis (IPFA2022), 18 July, Singapore (2022).

70.   Allen Gu, Masako Terada, Heiko Stegmann, Thomas Rodgers, Chao Fu, Yanjing Yang. From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis. The Proceedings of the 29th International Physics and Failure Analysis (IPFA2022), 18 July, Singapore (2022).

71.   Younan Hua, Lois Liao, Yanfei  Zhao, Linhua Zhang, Tingting He, Yuanyuan Liu , Xi Zhang, Chao Fu and Xiaomin Li. Studies and Applications of Al Bondpad Qualification and Monitoring Methodologies in Wafer Fabrication and Advanced Packaging. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 471, 10-13, Aug 2022, Dalian, China (2022).

72.   Jinzhi Lois Liao, Bisheng Wang, Xi Zhang, Younan Hua and Xiaomin Li, Reliability study of Au-Al wire bond under Cl environment. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 27, 10-13, Aug 2022, Dalian, China (2022).

73.   Linhua Zhang, Younan Hua and Xiaomin Li, Studies and Application of Failure Analysis Technology for Semiconductor Advanced Processes. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 472, 10-13, Aug 2022, Dalian, China (2022).

74.   Huan Xu, Lei Zhu, Younan Hua, Xiaomin Li and Jiahui Liu, Quantification of Doping Boron Ions in Si Embedded in Heavily Charging SiN/SiO2 Multiple-Layer Films by Dynamic SIMS. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 490, 10-13, Aug 2022, Dalian, China (2022)

75.   Liao Jinzhi Lois, Tian Meng, Du Yong, Ji Qiang, Zhu Lei, Zhang Xi, Hua Younan, Li Xiaomin. Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis. Microelectronics Reliability, ISSN: 0026-2714, 135，114607 (2022).

76.   Jinzhi Liao， Haifeng Zhao, Shengxiang Wang, Junrong Wang, Xi Zhang,Younan Hua， Xiaomin Li. Heavy water tracing method detects the water vapor intrusion path of LCD, Chinese Journal of Liquid Crystals and Displays (2022)

77.   Hua Younan, Liu Binghai, Liao Jinzhi Lois, Hsieh Chialum, Zhang Xi and Li Xiaomin. Studies of Electron Backscattered Diffraction (EBSD) Analysis Technique and Its Applications in Wafer Fabrication and Advanced Packaging. The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.

78.   Lois Jinzhi  Liao, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin. Study of moisture penetration in epoxy encapsulant by deuterium oxide (D2O) isotope tracing technique. The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.

79.   Liao Jinzhi Lois, Wang Bisheng, Zhang Xi, Hua Younan, Li Xiaomin. Chlorine and sulfur effects on copper wire bond reliability. The Proceedings of the 24th Electronics Packaging Technology Conference (EPTC 2022), Dec 7-9, 2022, Singapore (2022).

80.   Zhu Lei, and Li Xiaomin. “Surface Analysis Work Flow For NSOP Failure Cases” The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Conference Invited Talk, 10-13, Aug 2022, Dalian, China (2022).

Books

81.   Rakesh G. Mote and Li Xiaomin, Focused Ion Beam (FIB) Nanofinishing for Ultra-Thin TEM Sample Preparation. Section III Advanced Nanofinishing Processes, Nanofinishing Science and Technology, Basic and Advanced Finishing and Polishing Processes edited by V. K. JAIN, CRC Press, 15 Aug 2016, p155-178 (2016)

82.   Binghai Liu, Zhi Li Dong, Younan Hua, Chao Fu, Xiaomin Li, Pik Kee Tan, and Yuzhe Zhao Electron-beam radiation induced degradation of silicon nitride and its impact to semiconductor failure analysis by TEM, AIP Advances vol. 8, 115327 (2018).

Company Logo

83.   Wintech Nano Logo, Filed Trade Mark No. 40202117826R, Registrar of Trade Marks Singapore, 28 July 2021 (2021)