近期亮点

近期亮点

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辅助研发合作

辅助研发合作

概要:作为独立第三方分析和辅助研发机构,胜科纳米拥有高端实验室分析与研发能力。公司专注从事半导体材料分析、破坏性物理分析、失效分析、可靠性分析和辅助研发等服务,是国内半导体分析测试细分领域里的龙头企业和“隐形冠军”,也被业界誉为半导体芯片“全科医院”。
概要:作为独立第三方分析和辅助研发机构,胜科纳米拥有高端实验室分析与研发能力。公司专注从事半导体材料分析、破坏性物理分析、失效分析、可靠性分析和辅助研发等服务,是国内半导体分析测试细分领域里的龙头企业和“隐形冠军”,也被业界誉为半导体芯片“全科医院”。
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作为独立第三方分析和辅助研发机构,胜科纳米拥有高端实验室分析与研发能力,并与世界知名企业长期开展合作,积极参与多个半导体先进制程的研发项目。技术研发团队承接客户需求,对项目案件背景进行消化理解,将最终结论性报告直接反馈至客户公司研发部、工程部直接对接及设计方案,有效协助设备或产品的辅助研发工作,形成多项半导体产业发展的全球化产业链分工合作的经典案例,充分验证Labless新一代商业模式的可行性与无可比拟的巨大市场潜力。

胜科纳米通过近20年来的分析测试研究,建立超过600万大型数据库,拥有世界领先的独创分析技术近百余项,在半导体晶片制造、集成电路芯片封装、汽车电子新材料、新能源、化学化工、地质与矿物等领域积累了全产业链的综合分析能力。未来,胜科纳米将持续加强与半导体产业链的深度合作,切实保障客户利益,确保信息安全,并期待与更多合作伙伴携手共进,助力产业良性发展。

 

 

胜科纳米与世界知名企业合作

联合发表的论文(Publications)

 

2018年

1.Wang Bisheng, Lois Liao Jinzhi and Li Xiaomin. Characterization of interfacial intermetallic compounds in gold wire bonding with copper pad.  IEEE 20th Electronics Packaging Technology Conference, Singapore, p1-5 (2018).

 

2.Lois Liao Jinzhi; Chen Yan; Wang Bisheng; Li Xiaomin; Fu Chao; Hua Younan, A Review on the Copper Bond Pad Application in Wire Bond Technique,, The 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 IEEE , 08-11 Aug, Shanghai, China (2018).

 

2019年

1.Wang Bisheng, Lois Liao Jinzhi, Zhang Xi, Li Xiaomin, Hua Younan, Tee Weikok, Yee Boonhwa and Mao Songlin, Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 156; July 2019, Hangzhou, China (2019).

 

2.Lois Liao Jinzhi, Zhang Xi, Wang Bisheng, Li Xiaomin, Hua Younan, Fu Chao, Tee Weikok, Yee Boonhwa and Mao Songlin, Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations. The Proceedings of the ICICDT conference; 17-19 June 2019, Suzhou, China (2019).

 

2020年

1.Liao Jinzhi Lois1, Yu Minglang, Tee Weikok, Wang Bisheng, Jia Wenping, Yee Boonhwa, Zheng Haipeng, Zhang Xi, Fu Chao, Hua Younan and Li Xiaomin, COMPREHENSIVE COMPARISON OF THE WIRE BOND RELIABILITY PERFORMANCE OF CU, PDCU AND AG WIRES, CSTIC2020 Shanghai, China 18-20 March (2020).

 

2.Din-Ghee Neoh, Tee Weikok, Liao Jinzhi Lois, Jia Wenping, Yee Boonhwa, Boon-Seong LEE, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin, ENHANCING HIGH TEMPERATURE ADHESION PERFORMANCE VIA A RENOVATED LEADFRAME SURFACE TREATMENT, CSTIC2020, Shanghai, China 18-20 March (2020).

 

3.Liao Jinzhi Lois, Tee Weikok, Yu Minglang, Wang Bisheng, Zhang Xi, Yee Boonhwa, Hua Younan and Li Xiaomin, bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al, EPTC (2020), Singapore (2020).

 

2021年

1.Lois Jinzhi  Liao, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin. Study of moisture penetration in epoxy encapsulant by deuterium oxide (D2O) isotope tracing technique. The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.

 

2.Liao Jinzhi Lois, Wang Bisheng, Zhang Xi, Hua Younan, Li Xiaomin. Chlorine and sulfur effects on copper wire bond reliability. The Proceedings of the 24th Electronics Packaging Technology Conference (EPTC 2022), Dec 7-9, 2022, Singapore (2022).

 

 

 

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